High-Dielectric-Strength Al2O3 Ceramic Substrate Plates High Voltage Alumina Spacers for Power Electronics Components

Power electronics components must isolate high voltages while conducting heat away from switching devices, a combination that excludes most insulating materials. Our High-Dielectric-Strength Al2O3 Ceramic Substrate Plates solve both sides of the problem: they withstand repeated high voltage stress thanks to dielectric strength of 16 kV per millimeter, while their ceramic structure conducts heat more than twenty times better than typical PCB materials.

The plates are manufactured with tightly controlled thickness and camber so that power modules, IGBT substrates and heater plates assemble with uniform thermal contact. Surface finish can be specified as fired, ground or polished, and metallization can be added for direct bonding applications where the customer requires a ready to etch DBC style blank.

• High dielectric strength: 16 kV/mm rating provides reliable isolation margins in high voltage power assemblies.
• Excellent heat conduction: Thermal conductivity of 24 W/mK carries device heat to heatsinks far better than polymer insulators.
• Thin section capability: Plates as thin as 0.25 mm can be produced with consistent thickness for low thermal resistance.
• High operating temperature: Ceramic insulation keeps working at temperatures that destroy organic insulating films.
• Dimensional control: Tight thickness and camber control ensures uniform clamping and thermal interface performance.
• Metallization ready: Clean surfaces accept thin film, thick film or direct bond copper metallization processes.
• Custom formats: Round, square, stepped and hole patterned substrates produced to the module drawing.

These plates serve power electronics components including IGBT module insulation, power resistor bases, heater plate insulation, high voltage power supply spacers, solid state relay insulation and thermoelectric module substrates.

For module manufacturers we provide matched substrate lots with verified thickness, camber and dielectric testing data, supporting high yield assembly processes.

Substrates are interleaved with clean tissue paper, packed flat in rigid boxes with foam protection and shipped with edge protection against chipping.

Each lot is inspected for thickness, camber, surface quality and dielectric integrity before release, with reports supplied on request.