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Home > products > Ceramics Substrate > High Thermal Shock Silicon Nitride Ceramic Insert Positioning Plate

High Thermal Shock Silicon Nitride Ceramic Insert Positioning Plate

Product Details

Place of Origin: Made in China

Brand Name: wuxi special ceramic

Payment & Shipping Terms

Minimum Order Quantity: 10p

Price: us$1~us$100/P

Packaging Details: carton,wooden,box,pallet

Delivery Time: 30days

Payment Terms: T/T

Supply Ability: 5000p/Month

Get Best Price
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0.005mm Silicon Nitride Substrate

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Ceramics Substrate High Thermal Shock

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High Thermal Shock Si3n4 Substrate

Material:
Silicon Nitride
Feature:
High Hardness,high Thermal Shock
Size:
Customized
Name:
Ceramic Substrate
Tolerance:
0.005mm
Color:
Black
Specification:
Max. OD To Be 800mm
Flexural Strength:
>600Gpa
Compressive Strength:
2500Mpa
Application:
Structure Ceramic,semiconductor
Material:
Silicon Nitride
Feature:
High Hardness,high Thermal Shock
Size:
Customized
Name:
Ceramic Substrate
Tolerance:
0.005mm
Color:
Black
Specification:
Max. OD To Be 800mm
Flexural Strength:
>600Gpa
Compressive Strength:
2500Mpa
Application:
Structure Ceramic,semiconductor
High Thermal Shock Silicon Nitride Ceramic Insert Positioning Plate

Material Introduction:
Silicon Nitride (Si3N4) is a widely used ceramic material in high temperature application, it has high strength in both room temperature and high temperature condition, the strength of silicon nitride can be kept up to 1200ºC; the low coefficient of thermal expansion make it a ceramic material possessing excellent thermal shock resistance; at the same time, it also has good thermal conductivity.

Features of Silicon Nitride wafer:

a. high temperature strength
b. superior thermal shock resistance
c. excellent wear resistance
d. good fracture toughness
e. mechanical fatigue and creep resistance
f. Excellent non-wetting property with good oxidation resistance

The main features of the Si3N4 ceramic tray and substrate
A. High thermal conductivity ( up to 70 W/m.k), 3 times that of alumina ceramic substrate;
B. The thermal expansion coefficient (3.1×10-6/ºC) matches the semiconductor silicon material (3.5-4.0×10-6/ºC);
C. The bending strength is higher than that of the alumina substrate, which is twice that of the alumina substrate;
D. Excellent electrical performance, with extremely high insulation resistance and low dielectric loss;
E. The compatibility of circuit materials is good, and multi-layer wiring can be performed to achieve miniaturization of the package;
F. High thermal shock resistance, from 0 ºC to 200 ºC and then cool down, repeat 10000 times;
G. Chemical resistance, resistant oxidization, acid, alkali corrosion, service life-span up to 10 years

 

The specification of the ceramic tray and substrate
A.The typical thickness of the silicon nitride substrate covers 0.30mm, 0.5mm, 0.635mm, 1.0mm
B.We are supplying with many round ceramic wafers, square & rectangular ceramic substrate
C.The biggest diameter of the round ceramic wafer can be up to 400mm in 3mm, 4mm, 5mm thick
D.The max. side-length of the square and rectangular ceramic substrate can be 400mm by 500mm
E.Surface treatment: it can be one-side, or double side polished to be Ra0.4 or better

 

Silicon nitride is a man-made compound synthesized through several different chemical reaction methods. Parts are pressed and sintered by well-developed methods to produce a ceramic with a unique set of outstanding properties. The material is dark gray to black in color and can be polished to a very smooth reflective surface, giving parts a striking appearance. High-performance silicon nitride materials were developed for automotive engine wear parts, such as valves and cam followers, and proven effective. The cost of the ceramic parts never dropped enough to make the ceramics feasible in engines and turbochargers. The very high-quality bodies developed for these demanding high-reliability applications are available today and can be used in many severe mechanical, thermal, and wear applications.

High Thermal Shock Silicon Nitride Ceramic Insert Positioning Plate 0

 

date sheet

 

Item Unit Typical Values
Physical Properties
Density g/cm3 >3.2
Mechanical Properties
Hardness HRA90
Vickers Hardness (Hv50) HV0.5 >1550
Modulus of Elasticity Gpa 290
Flexural Strength Mpa >600
Compressive Strength Mpa 2500
Fracture toughness Mpam1/2 >6.0
Thermal Properties
Maximum use temperature °C 1200
Thermal Conductivity W/(m.k) 15-20
Thermal Expansion Coefficient 10-6/°C >3.1
Thermal Shock Resistance T°C 500
Specific Heat Capacity KJ/kg.K 700
Electrical Properties
Dielectric Strength KV/mm 1
Dielectric Constant er
Volume Resistivity at 20°C Ω.cm 1.0X10(12)


company information
Wuxi Special Ceramic Co.,Ltd mainly produces alumina, Silicon nitride, Zirconia, Steatite, Boron nitride, Cordierite,mullite products, widely used in metal welding, electronic conductor, mechanics, assembling, insulation, chemicals, instrument, textile, nuclear industry, aerial field.We accept trial produce according to the drawing or sample.It usually takes 30 days to finish trial product.Mass produce usually takes 30 days.Goods' package is carton or PLT.It can be negotiable with each other.
We mainly sell goods to toshiba lighting group in Japan and Europe.Our aim is to deliver goods with high quality at quick delivery date.
 
High Thermal Shock Silicon Nitride Ceramic Insert Positioning Plate 1
 
High Thermal Shock Silicon Nitride Ceramic Insert Positioning Plate 2