FR-4 vs. High-Tg as a Lens: Ceramic Substrate Future Is Scenario-Driven, Not Single-Winner
2025-01-01
In PCB technology, FR-4 has not been eliminated by high-Tg materials; they coexist in different roles. The
same pattern is emerging for Al₂O₃, AlN and Si₃N₄ ceramic substrates.
When 800 V platforms require Si₃N₄ for extreme reliability, 5G base stations rely on AlN for low dielectric loss, and smart devices favor Al₂O₃ for cost, the real decision is about optimizing performance, cost and scenario fit—not just picking the material with the highest numbers on paper.
Thus, when planning ceramic substrate roadmaps, it is essential to define target markets, failure modes and cost constraints first, then construct a material portfolio from Al₂O₃ / AlN / Si₃N₄, instead of betting on one “universal” solution.
In that sense, the future of ceramic substrates is a long-term game of multi-material coexistence, not a short-term winner-takes-all battle.