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Home > products > Ceramics Substrate > 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

Product Details

Place of Origin: Made in China

Brand Name: wuxi special ceramic

Payment & Shipping Terms

Minimum Order Quantity: 10p

Price: us$1~us$100/P

Packaging Details: carton,wooden,box,pallet

Delivery Time: 30days

Payment Terms: T/T

Supply Ability: 1000000p/Month

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3.8g cm3 Laser Machining Ceramic Substrates

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3.8g cm3 Slice Ceramic Substrate

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3.8g cm3 Si3O4 Ceramics Substrates

Material:
Alumina Ceramic,zirconia,Si3O4
Color:
White/black
Shape:
Customized
Application:
Industrial Ceramic,machinery,electronic,chemical
Density:
>3.8g/cm3
Feature:
High Electrical Insulation,low Dielectric Constant,high Temperature
Water Absorption:
O
Place Of Orgin:
Jiangsu,china
Type:
Ceramic Parts
Max Working Temperature:
>800℃
Material:
Alumina Ceramic,zirconia,Si3O4
Color:
White/black
Shape:
Customized
Application:
Industrial Ceramic,machinery,electronic,chemical
Density:
>3.8g/cm3
Feature:
High Electrical Insulation,low Dielectric Constant,high Temperature
Water Absorption:
O
Place Of Orgin:
Jiangsu,china
Type:
Ceramic Parts
Max Working Temperature:
>800℃
3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

laser cutting alumina ceramic precision made industrial substrate 

The ceramic substrate, is a sheet-like material that forms a supporting base for the film circuit component and the externally-applied component on the basis of the electronic ceramic. According to the application field of ceramic substrate, it is divided into HIC (hybrid integrated circuit) ceramic substrate, focusing potentiometer ceramic substrate, laser heating fixing ceramic substrate, chip resistor substrate, network resistor Substrate, etc.; according to different processing methods, ceramic substrates are divided into two types: molded tablets and laser scribe films.

 

3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates 0

Type of ceramic cutting: alumina zirconia silicon nitride aluminum nitride ceramics;
Cutting the highest precision: ± 0.02;
Cutting maximum size: 1*152.4*152.4mm;
Cutting minimum aperture: diameter φ0.1mm;
Cutting maximum thickness: 1.5mm (mm);
Number of cuts: The more the better.

Name Ceramic Substrate
Color White(general)
Specifications Customized
Accuracy ±0.01
Density 3.8g/cm3
Hardness Rockwell hardness HRA89 (steel knife hardness HRC60) Mohs hardness is 9; HV1500-1700
Modulus of elasticity 380GPa
Bending strength 300Mpa
Compressive strength 2500MPa
Melting point 2050 ° C
High temperature resistance 1800 ° C
Thermal conductivity 39W/(m.K)
Thermal expansion coefficient 8.6X10-6/°C
Breakdown strength (insulation strength) 15KV/mm
Resistivity 1015/Ω.m

 

 

company information

 

Wuxi Special Ceramic Co.,Ltd mainly produces alumina, Silicon nitride, Zirconia, Steatite, Boron nitride, Cordierite,mullite products, widely used in metal welding, electronic conductor, mechanics, assembling, insulation, chemicals, instrument, textile, nuclear industry, aerial field.We accept trial produce according to the drawing or sample.It usually takes 30 days to finish trial product.Mass produce usually takes 30 days.Goods' package is carton or PLT.It can be negotiable with each other.
We mainly sell goods to toshiba lighting group in Japan and Europe.Our aim is to deliver goods with high quality at quick delivery date.

 

3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates 1

 

3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates 2